WCSOI-2027
Conference Tracks

Tracks spanning wafers, optoelectronics and integrated devices

The scientific programme is organised into focused tracks. Submit your abstract to the track that best fits your work.

01

Advanced Semiconductor Materials & Device Technologies

Research on wide-bandgap materials, SiC, GaN, emerging semiconductor systems and advanced device architectures.

  • ▸Wide-Bandgap Semiconductor Materials
  • ▸Silicon Carbide and Gallium Nitride
  • ▸Emerging Semiconductor Materials
  • ▸Advanced Device Architectures
02

Next-Generation Transistors & Nanoelectronics

Transistor scaling, FinFET, gate-all-around, nanosheet and low-power nanoelectronic device technologies.

  • ▸Gate-All-Around and Nanosheet Transistors
  • ▸FinFET and Beyond-CMOS Technologies
  • ▸Nanoscale Device Engineering
  • ▸Low-Power Transistor Technologies
03

2D Materials & Atomically Thin Electronics

Graphene, transition metal dichalcogenides, van der Waals systems and ultra-thin electronic platforms.

  • ▸Graphene and Transition Metal Dichalcogenides
  • ▸2D Semiconductor Devices
  • ▸van der Waals Heterostructures
  • ▸Flexible and Ultra-Thin Electronics
04

Semiconductor Photonics & Optoelectronic Devices

Silicon photonics, integrated photonic devices, optical modulators, detectors and high-speed communications.

  • ▸Silicon Photonics
  • ▸Integrated Photonic Devices
  • ▸Photodetectors and Optical Modulators
  • ▸High-Speed Optical Communication Devices
05

Quantum Semiconductor Devices & Quantum Electronics

Quantum dots, wells, heterostructures, single-photon devices and semiconductor quantum hardware.

  • ▸Semiconductor Quantum Dots
  • ▸Quantum Wells and Quantum Heterostructures
  • ▸Single-Photon Devices
  • ▸Quantum Information Hardware
06

Power Semiconductors & High-Efficiency Electronics

SiC, GaN, high-voltage, high-frequency and efficient power conversion device technologies.

  • ▸SiC and GaN Power Devices
  • ▸High-Voltage Semiconductor Technologies
  • ▸High-Frequency Power Electronics
  • ▸High-Efficiency Power Conversion
07

Advanced Memory & Emerging Computing Devices

3D NAND, RRAM, memristors, spintronics and emerging non-volatile memory technologies.

  • ▸3D NAND and Advanced Memory Architectures
  • ▸Resistive RAM and Memristors
  • ▸Spintronic Memory
  • ▸Emerging Non-Volatile Memory
08

AI Hardware & Neuromorphic Semiconductor Technologies

AI accelerators, in-memory computing, neuromorphic hardware and energy-efficient chip technologies.

  • ▸AI Accelerators
  • ▸In-Memory Computing
  • ▸Neuromorphic Hardware
  • ▸Energy-Efficient AI Chips
09

Integrated Circuits & Advanced System-on-Chip Technologies

Advanced CMOS, SoC design, heterogeneous computing and high-performance integrated circuits.

  • ▸Advanced CMOS Technologies
  • ▸System-on-Chip Design
  • ▸Heterogeneous Computing
  • ▸High-Performance Integrated Circuits
10

Advanced Semiconductor Packaging & 3D Integration

Chiplets, 2.5D and 3D integration, heterogeneous packaging and high-bandwidth interconnects.

  • ▸2.5D and 3D Chip Integration
  • ▸Chiplets and Advanced Packaging
  • ▸Heterogeneous Integration
  • ▸High-Bandwidth Interconnects
11

Compound Semiconductors & High-Frequency Devices

GaN, GaAs, InP, RF, microwave and high-power semiconductor technologies.

  • ▸GaN and GaAs Devices
  • ▸InP-Based Technologies
  • ▸RF and Microwave Semiconductors
  • ▸High-Frequency and High-Power Devices
12

Flexible, Wearable & Printed Electronics

Flexible devices, stretchable electronics, printed systems and wearable sensors.

  • ▸Flexible Semiconductor Devices
  • ▸Stretchable Electronics
  • ▸Printed Electronics
  • ▸Wearable Sensors and Integrated Systems
13

Sensors, MEMS & Integrated Sensing Devices

MEMS, NEMS, biosensors, environmental sensors and smart sensing platforms.

  • ▸MEMS and NEMS Devices
  • ▸Semiconductor Biosensors
  • ▸Integrated Environmental Sensors
  • ▸Smart Sensing Platforms
14

Advanced Semiconductor Manufacturing & Process Technology

EUV lithography, ALD, process integration, yield optimization and manufacturing control.

  • ▸EUV and Advanced Lithography
  • ▸Atomic Layer Deposition
  • ▸Semiconductor Process Integration
  • ▸Yield Optimization and Process Control
15

Future Semiconductor & Integrated Device Technologies

Beyond-CMOS computing, photonic-electronic integration, neuromorphic and quantum device architectures.

  • ▸Beyond-CMOS Computing
  • ▸Photonic and Electronic Integration
  • ▸Neuromorphic and Quantum Devices
  • ▸Next-Generation Semiconductor Architectures
Call for Papers

Have research to share?

Submit your abstract to one of the tracks and present your work to an international audience.

Submit an Abstract

July 26–28, 2027 · London

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